S10

3D Hybrid Modular

Yamaha S10

Yamaha S10 

3D MID* yerleştirmeyi gerçekleştirmek için muhteşem esneklik


  • 3D MID yerleştirmeyi gerçekleştirmek için muhteşem esneklik
  • 3D MID için geliştirilmiş
  • Büyük board kullanabilme yeteneği
  • Geniş yelpazede komponent kullanabilme yeteneği ve yüksek feeder kapasitesi
  • Muhteşem esneklik ve hızlı&kolay kurulum


*3D MID: kalıplanmış iç bağlantı aygıtı


Yamaha S10

  • Model
S10
  • Board size
    (with buffer unused)
Min. L 50 x W 30 mm to Max. L 1,330 x W 510 mm (Standard L 955)
  • Board size
    (with input or output buffers used)
Min. L 50 x W 30 mm to Max. L 420x W 510 mm
  • Board size
    (with input and output buffers used)
Min. L 50 x W 30 mm to Max. L 330x W 510 mm
  • Board thickness
0.4 – 4.8 mm
  • Board flow direction
Left to right (Std)
  • Board transfer speed
Max 900 mm/sec
  • Placement speed
    (12 heads + 2 theta) Opt. Cond.
0.08 sec/CHIP (45,000 CPH)
  • Placement accuracy A (μ+3σ)
CHIP +/- 0.040 mm
  • Placement accuracy B (μ+3σ)
IC +/- 0.025 mm
  • Placement angle
+/- 180 degrees
  • Z axis control/ Theta axis control
AC servo motor
  • Component height
Max 30 mm*1 (Pre-placed components: max 25 mm)
  • Applicable components
0201 mm – 120 x 90 mm, BGA, CSP, connector, etc.
  • Component package
8 – 56 mm tape (F1/F2 Feeders), 8 – 88 mm tape (F3 Electric Feeders), stick, tray
  • Drawback check
Vacuum check and vision check
  • Screen language
English, Chinese, Korean, Japanese
  • Board positioning
Board grip unit, front reference, auto conveyor width adjustment
  • Component types
Max 90 types (8 mm tape), 45 lanes x 2
  • Transfer height
900 +/- 20 mm
  • Machine dimensions, weight
L 1250 x D 1750 x H 1420 mm, Approx. 1150 kg
*1) Board thickness + Component height = Max 30mm
Some specifications and parts of the external appearance are subject to change without notice.


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